(钢筋的)拔拉握裹试验
This paper studied the influence of the different conductor material such as AU| Pd-Au, the different film thickness. 125 ℃. 300 ℃ thermal aging and temperature cycle on bond strength with two methods of destructive wire bond pull test and bond contact resistance test.
本文使用焊点破坏性拉力试验和焊点的接触电阻测试两种方法,研究了导体材料(Au、Pd&Au)、膜层厚度、125℃、300℃热老练和温度循环对焊点键合强度的影响。
Pull thrust test is a destructive bond pull test, so only selected groups of solder joints are measured and can not cover all of the solder joints.
由于拉推力检测是破坏性检测,只能对部分焊点进行抽检而无法进行全检。
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